|
|
|
||
| (1 of 9) | |||
| United States Patent | 5,897,351 |
| Forbes | Apr. 27, 1999 |
Abstract
A gain memory cell formed by merged n-channel and p-channel field-effect transistors wherein the body portion of the p-channel transistor is coupled to the charge storage node of the memory cell for providing a bias to the body of the p-channel transistor that varies as a function of the data stored by the memory cell. The stored charge is sensed indirectly in that the stored charge modulates the conductivity of the p-channel transistor so that the p-channel transistor has a first turn-on threshold for a stored logic "1" condition and a second turn-on threshold for a stored logic "0" condition. Consequently, a small storage node capacitance can be used, reducing the overall volume of the cell. The gain memory cell has a single internal contact and only two lines are required for operation of the gain memory cell. The internal contact is formed along a sidewall of an isolation trench, minimizing the surface area of the memory cell.
| Inventors: | Forbes; Leonard (Corvallis, OR). |
| Assignee: | Micron Technology, Inc. (Boise, ID). |
| Appl. No.: | 916,933 |
| Filed: | Aug. 21, 1997 |
| Division of Ser No. 804,179, Feb. 21, 1997, Pat. No. 5,732,014. |
| Intl. Cl. : | H01L 21/8242 |
| Current U.S. Cl.: | |
| Field of Search: | 438/238-259, 381-399, 149, 311 |
| 4,970,689 | Nov., 1990 | Kenney | 365/189.01 |
| 4,999,811 | Mar., 1991 | Banerjee | 365/149 |
| 5,066,607 | Nov., 1991 | Banerjee | 437/52 |
| 5,122,986 | Jun., 1992 | Lim et al. | 365/189.11 |
| 5,134,083 | Jul., 1992 | Matthews | |
| 5,214,603 | May, 1993 | Dhong et al. | |
| 5,220,530 | Jun., 1993 | Itoh | 365/189.01 |
| 5,308,783 | May, 1994 | Krautschneider et al. | 437/52 |
| 5,448,513 | Sept., 1995 | Hu et al. | 365/150 |
Cottrell, P., et al., "N-Well Design for Trench DRAM Arrays", IEEE, Abstract of Int. Electron Device Meeting, pp. 584-587, (1988).
Ema, T., et al., "3-Dimensional Stacked Capacitor Cell for 16M and 64M DRAMs", IEDM, Abstract of Int. Electron Device Meeting, pp. 592-595, (1988).
Kim, W., et al., "An Experimental High-Density DRAM Cell with a Built-in Gain Stage", IEEE Journal of Solid-State Circuits, vol. 29, No. 8, 978-981, (1994).
Krautschneider, F., et al., "Planar Gain Cell for Low Voltage Operation and Gigabit Memories", Symposium on VLSI Technology Digest of Technical Papers, 139-140, (1995).
Kuge, S., et al., "SOI-DRAM Circuit Technologies for Low Power High Speed Multigiga Scale Memories", IEEE Journal of Solid-State Circuits, 31, 586-591, (Apr., 1996).
Shukuri, S., et al., "A Complementary Gain Cell Technology for Sub-1V Supply DRAMs", Ext. Abs. of IEEE Int. Electron Device Meeting, 1006-1008, (1992).
Shukuri, S., et al., "A Semi-Static Complementary Gain Cell Technology for Sub-1 V Supply DRAMs", IEEE Transactions on Electron Devices, vol. 41, No. 6, 926-931, (Jun., 1994).
Shukuri, S., et al., "Super-Low Voltage Operation of a Semi-Static Complementary Gain DRAM Memory Cell", VLSI Tech. Symposium, 23-24, (1993).
Sunouchi, K., et al., "A Self Amplifying (SEA) Cell for Future High Density DRAMs", ULSI Research Center, Toshiba Corporation, 17.1.1-17.1.4, (1991).
Terauchi, M., et al., "A Surrounding Gate Transistor (SGT) Gain Cell for Ultra High Density DRAMs", VLSI Tech. Symposium, 21-22, (1993).
Wann, H., et al., "A Capacitorless DRAM Cell on SOI Substrate", Ext. Abs. IEEE Int. Electron Devices Meeting, 635-638, (1993).
|
|
|
||
| (1 of 9) | |||