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|United States Patent||6,025,261|
|Farrar, et. al.||Feb. 15, 2000|
A first insulator is formed on a base layer. A first conductor is formed on the first insulator. The first conductor is patterned. A second insulator is formed over the first insulator. A via hole is formed in the second insulator and is electrically coupled to the first conductor through the via hole. A second conductor is formed on the second insulator, and is electrically coupled to the first conductor by the via hole. The second conductor is patterned. A cavity is formed under the second conductor, and in the first and second insulators.
|Inventors:||Farrar; Paul A. (So. Burlington, VT); Forbes; Leonard (Corvallis, OR).|
|Assignee:||Micron Technology, Inc. (Boise, ID).|
|Filed:||Apr. 29, 1998|
|Intl. Cl. :||H01L 27/764|
|Current U.S. Cl.:||438/619; 257/522; 257/758; 438/622; 438/624|
|Field of Search:||438/411, 619, 622, 624; 257/522, 758|
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|5,798,544||Aug., 1998||Ohya et al.||257/296|
|5,930,596||Sept., 1996||Klose et al.||438/622|
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