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United States Patent 6,090,636
Geusic, et. al. Jul. 18, 2000

Integrated circuits using optical waveguide interconnects formed through a semiconductor wafer and methods for forming same


An integrated circuit with a number of optical waveguides that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical waveguides include a highly reflective material that is deposited so as to line an inner surface of the high aspect ratio holes which may be filled with air or a material with an index of refraction that is greater than 1. These metal confined waveguides are used to transmit signals between functional circuits on the semiconductor wafer and functional circuits on the back of the wafer or beneath the wafer.

Inventors: Geusic; Joseph E. (Berkeley Heights, NJ); Ahn; Kie Y. (Chappaqua, NY); Forbes; Leonard (Corvallis, OR).
Assignee: Micron Technology, Inc. (Boise, ID).
Appl. No.: 31,961
Filed: Feb. 26, 1998
Intl. Cl. : H01L 21/302
Current U.S. Cl.: 438/31; 438/107; 438/456
Field of Search: 438/6, 27, 29, 31, 46, 65, 67, 69, 93, 106, 107, 108, 109, 455, 456; 257/777, 686, 466, 432

References Cited | [Referenced By]

U.S. Patent Documents
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Foreign Patent Documents
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Other References

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Primary Examiner: Mulpuri; Savitri
Attorney, Agent or Firm: Schwegman, Lundberg, Woessner & Kluth, P.A.
27 Claims, 8 Drawing Figures

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