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United States Patent 6,122,187
Ahn, et. al. Sept. 19, 2000

Stacked integrated circuits

Abstract

System modules are described which include a stack of interconnected semiconductor dies. The semiconductor dies are interconnected by micro bump bonding of coaxial lines that extend through the thickness of the various dies. The coaxial lines also are selectively connected to integrated circuits housed within the dies. In one embodiment, a number of memory dies are interconnected in this manner to provide a memory module.


Inventors: Ahn; Kie Y. (Chappaqua, NY); Forbes; Leonard (Corvallis, OR).
Assignee: Micron Technology, Inc. (Boise, ID).
Appl. No.: 198,554
Filed: Nov. 23, 1998
Intl. Cl. : G11C 5/06
Current U.S. Cl.: 365/63; 257/673; 257/686; 365/52; 438/613
Field of Search: 365/51, 52, 63, 72; 257/673, 686, 774, 777

References Cited | [Referenced By]

U.S. Patent Documents
4,394,712Jul., 1983Anthony 361/411
5,200,917Apr., 1993Shaffer 365/51
5,352,998Oct., 1994Tamino 333/247
5,362,976Nov., 1994Suzuki 257/81
5,399,898Mar., 1995Rostoker 257/499
5,404,044Apr., 1995Booth et al. 257/686
5,432,729Jul., 1995Carson et al. 365/63
5,434,452Jul., 1995Higgins, III 257/773
5,532,506Jul., 1996Tserng 257/276
5,578,526Nov., 1996Akram 437/209
5,608,265Mar., 1997Kitano et al. 257/686
5,656,548Aug., 1997Zavracky et al 438/23
5,661,901Sept., 1997King 29/830
5,682,062Oct., 1997Gaul 257/686
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5,783,870Jul., 1998Mostafazadeh et al. 257/686
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5,901,050May, 1999Imai 361/820
5,902,118May, 1999Hubner 438/106
5,903,045May, 1999Bertin et al. 257/621
5,915,167Jun., 1999Leedy 438/108
5,973,392Oct., 1999Senba et al. 257/686
5,995,379Nov., 1999Kyougoku et al. 361/903

Foreign Patent Documents
94/05039Mar., 1994WO
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Primary Examiner: Nguyen; Tan T.
Attorney, Agent or Firm: Schwegman, Lundberg, Woessner & Kluth, P.A.
23 Claims, 10 Drawing Figures

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