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United States Patent 6,150,188
Geusic, et. al. Nov. 21, 2000

Integrated circuits using optical fiber interconnects formed through a semiconductor wafer and methods for forming same


An integrated circuit with a number of optical fibers that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical fibers include a cladding layer and a core formed in the high aspect ratio hole. These optical fibers are used to transmit signals between functional circuits on the semiconductor wafer and functional circuits on the back of the wafer or beneath the wafer.

Inventors: Geusic; Joseph E. (Berkeley Heights, NJ); Ahn; Kie Y. (Chappaqua, NY); Forbes; Leonard (Corvallis, OR).
Assignee: Micron Technology Inc. (Boise, ID).
Appl. No.: 31,975
Filed: Feb. 26, 1998
Intl. Cl. : H01L 21/00
Current U.S. Cl.: 438/31; 438/107; 438/456; 438/65
Field of Search: 438/29, 31, 455, 667, 27, 46, 65, 67, 69, 93, 107, 108, 956; 257/686, 432

References Cited | [Referenced By]

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Primary Examiner: Chaudhuri; Olik
Assistant Examiner: Eaton; Kurt
Attorney, Agent or Firm: Schwegman, Lundberg, Woessner & Kluth, P.A.
22 Claims, 11 Drawing Figures

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