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|United States Patent||6,306,681|
|Ahn ,   et al.||October 23, 2001|
A multichip module includes an interposer formed from a semiconductor material and having a plurality of interconnections formed on a surface of the interposer. A plurality of integrated circuits is mounted on the interposer and is electrically coupled to the interconnections. One or more repeater circuits are disposed along a length of at least one of the plurality of interconnections. A lid seals the plurality of integrated circuits from environmental insults. As a result, RC transmission line effects and crosstalk effects are reduced for signals propagating from one of the integrated circuits to another across the surface of the interposer. Additionally, thermal coefficient of expansion mismatch is reduced or eliminated between the integrated circuits and interposer.
|Inventors:||Ahn; Kie Y. (Chappaqua, NY); Forbes; Leonard (Corvallis, OR)|
|Assignee:||Micron Technology, Inc. (Boise, ID)|
|Filed:||August 18, 1999|
|Current U.S. Class:||438/107; 438/128; 438/6; 438/10; 257/691; 361/728; 439/55|
|Intern'l Class:||H01L 021/82|
|Field of Search:||438/128,129,130,131,132,108 257/691 361/600,679,728,820 439/55|
|5854534||Dec., 1998||Beilin et al..|
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