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United States Patent | 6,395,630 |
Ahn ,   et al. | May 28, 2002 |
System modules are described which include a stack of interconnected semiconductor dies. The semiconductor dies are interconnected by micro bump bonding of coaxial lines that extend through the thickness of the various dies. The coaxial lines also are selectively connected to integrated circuits housed within the dies. In one embodiment, a number of memory dies are interconnected in this manner to provide a memory module.
Inventors: | Ahn; Kie Y. (Chappaqua, NY); Forbes; Leonard (Corvallis, OR) |
Assignee: | Micron Technology, Inc. (Boise, ID) |
Appl. No.: | 854809 |
Filed: | May 14, 2001 |
Current U.S. Class: | 438/667; 438/613; 257/673 |
Intern'l Class: | H01L 021/20 |
Field of Search: | 438/389,542,667,668,613 257/673,686,774,777 365/52,63 264/104 |
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Foreign Patent Documents | |||
94/05039 | Mar., 1994 | WO | . |
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