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|United States Patent||6,432,724|
|Ahn ,   et al.||August 13, 2002|
A method and apparatus for producing buried ground planes in a silicon substrate for use in system modules is disclosed. Conductor patterns are printed on the surface of the silicon substrate. Pores are created in the printed conductor patterns by a chemical anodization process. The pores are then filled with a conductive metal, such as tungsten, molybdenum, or copper by a selective deposition process to produce a low impedance ground buried in the substrate.
|Inventors:||Ahn; Kie Y. (Chappaqua, NY); Forbes; Leonard (Corvallis, OR)|
|Assignee:||Micron Technology, Inc. (Boise, ID)|
|Filed:||November 25, 1998|
|Current U.S. Class:||436/667; 438/960|
|Intern'l Class:||H01L 021/44|
|Field of Search:||438/667,960|
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