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United States Patent | 6,534,855 |
Ahn ,   et al. | March 18, 2003 |
A wireless communication system comprising a carrier having a top and a bottom surface, and a plurality of integrated circuit components for transmitting and receiving communication signals located on the top and bottom surfaces of the carrier. At least one passageway extends through the carrier, and conductive material extends through the passageway for electrically interconnecting the integrated circuit components located on the top and bottom surfaces of the carrier.
Inventors: | Ahn; Kie Y. (Chappaqua, NY); Forbes; Leonard (Corvallis, OR) |
Assignee: | Micron Technology, Inc. (Boise, ID) |
Appl. No.: | 384193 |
Filed: | August 27, 1999 |
Current U.S. Class: | 257/698; 438/106; 438/719; 438/667; 257/723 |
Intern'l Class: | H01L 021/44; H01L 023/04 |
Field of Search: | 438/667,668,719,710,106,107,109 257/700,712,710,621,698,723 |
5682062 | Oct., 1997 | Gaul | 257/686. |
5770889 | Jun., 1998 | Rostoker et al. | 257/698. |
6187677 | Feb., 2001 | Anh | 438/667. |
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